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Core hardware

Embedded Systems & Hardware Development Services

India-based embedded product engineering for global teams, covering system architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation, certification support and manufacturing handoff. You receive the source design files, BOM and test evidence needed to own and scale the product.

Quick answer

What we build
Embedded product hardware: system architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation, certification support and manufacturing handoff.
Who it is for
Companies turning a concept or proof of concept into a validated, manufacturable board, including teams without in-house hardware engineers.
Typical timeline
3–18 months. About 3–6 months for a simple product; complex systems can take 12–18 months
Typical cost
Quoted per project as a fixed-scope proposal. For typical ranges, see our hardware development cost benchmarks.
Designed to
IEC 60601-1 and IEC 62304 requirements for medical products, with design documentation structured so the manufacturer's ISO 13485 quality system can absorb it; IEC 61508 or ISO 26262 requirements where functional safety applies; AEC-Q100/Q200-qualified parts for automotive.
Deliverables
Source design files, BOM, Test evidence
Tools and technologies
ARM Cortex-M/A and RISC-V, Altium Designer, KiCad, LTspice

Every project is quoted as a fixed-scope proposal within 3–5 business days of a discovery call. Discuss your product

Specifications

  • Up to 24-layer PCBs
  • 48–72 h standard prototypes (up to 8 layers, partner fabs)
  • ARM Cortex-M/A and RISC-V

Capabilities

What we deliver

Advanced PCB design & layout

Our specialized PCB design services cover everything from simple 2-layer boards to complex high-density interconnect (HDI) designs up to 24 layers. We optimize every aspect including high-speed digital routing (DDR4/DDR5, PCIe, USB 3.x), controlled impedance traces, thermal management, and EMC design.

System-on-chip (SoC) integration

SoC designs on Arm Cortex-M and Cortex-A and on RISC-V: processor integration, memory interfaces (DDR3/4/5, eMMC, NAND/NOR flash), peripheral connectivity and power-management ICs, balanced for performance, power and unit cost.

Rapid prototyping & validation

Standard prototype boards up to 8 layers are fabricated and assembled through our partner PCB fabs in 48–72 hours; complex multilayer, HDI or RF boards typically take 5–7 business days. Each build is then brought up and functionally tested, with signal-integrity and thermal checks where the design needs them.

Strategic component selection

Our component engineering team focuses on performance optimization, cost reduction, and supply chain reliability. We evaluate components for electrical specifications, thermal characteristics, availability, lead times, and long-term support. Our vendor relationships and component database help avoid obsolescence issues that can derail projects.

Hardware security implementation

Security is built into every design layer. We implement secure boot with hardware root of trust, cryptographic accelerators, hardware security modules (HSM), secure element integration (ATECC608, SE050), physical tamper detection, and side-channel attack mitigation. We design to PSA Certified and SESIP security requirements and can prepare evidence for a certification lab; certification is issued by the scheme's evaluation lab.

Low-power design optimization

Our power management work is aimed at long battery life, confirmed by measuring the current profile of the assembled device. We implement advanced sleep modes, dynamic voltage/frequency scaling, power gating, efficient DC-DC converters, and intelligent wake-on-event systems. Power consumption is analyzed at every design stage using hardware-in-the-loop testing.

2 more capabilities

Edge AI & machine learning hardware

We design hardware optimized for edge AI inference including neural network accelerators (NPUs), DSP integration, and efficient memory architectures. Our solutions support TensorFlow Lite, ONNX Runtime, and vendor-specific AI frameworks. Applications include computer vision, predictive maintenance, voice recognition, and anomaly detection.

Sensor fusion & integration

Our sensor integration expertise spans IMUs (accelerometers, gyroscopes, magnetometers), environmental sensors (temperature, humidity, pressure), optical sensors (ambient light, proximity, color), biosensors (PPG, ECG, bioimpedance), and industrial sensors (vibration, current, voltage). Advanced fusion algorithms combine multiple sensor inputs for enhanced accuracy.

Capabilities and deliverables

Design expertise

  • Microcontroller and processor selection: ARM Cortex-M0/M3/M4/M7, Cortex-A series, RISC-V, ESP32, Nordic nRF, STM32, and custom FPGA solutions
  • FPGA development with AMD Xilinx (Vivado) and Altera (Quartus) platforms, RTL design in Verilog/VHDL, and high-level synthesis
  • High-speed digital design: DDR4/5 memory interfaces, PCIe Gen3/4, USB 3.x, MIPI CSI/DSI, Gigabit Ethernet, and SerDes interfaces
  • Mixed-signal circuit design: precision ADCs/DACs, analog front-ends, signal conditioning, and noise-optimized layouts

Quality and compliance

  • Automated design verification using simulation, hardware-in-the-loop testing, and comprehensive test coverage analysis
  • Pre-compliance EMC/EMI scans at accredited partner labs, followed by certification support for CE, FCC, ISED and other markets
  • Design for Manufacturing (DFM), Design for Test (DFT), and Design for Assembly (DFA) optimization for cost-effective production
  • Quality-managed processes aligned with ISO 9001:2015, with complete design documentation, revision control, and traceability

Industry-specific requirements

  • Medical devices: designed to IEC 60601-1 and IEC 62304 requirements, with design documentation that supports the manufacturer's ISO 13485 / FDA QMSR (21 CFR Part 820) design-control records, and biocompatible materials
  • Industrial IoT: designed to IEC 61508 requirements where functional safety applies, with ATEX/IECEx certification carried out by a notified body, and wide temperature range designs
  • Consumer electronics: designs prepared for CE/FCC/ISED certification testing and RoHS/REACH declarations, miniaturized designs, and cost optimization for volume production
  • Automotive electronics: designed to ISO 26262 requirements for the target ASIL, AEC-Q100/Q200 parts, and AUTOSAR-compatible interfaces

Tools and platforms

  • ARM Cortex-M/A
  • RISC-V
  • ESP32/ESP8266
  • Nordic nRF52/53
  • STM32
  • AMD Xilinx FPGA
  • Altera FPGA
  • Altium Designer
  • KiCad
  • Cadence Allegro
  • HyperLynx
  • LTspice
  • Ansys SIwave
  • MATLAB/Simulink

We design custom boards around STM32 microcontrollers, ESP32 Wi-Fi and Bluetooth SoCs, Nordic nRF52, nRF53 and nRF91 wireless SoCs and NVIDIA Jetson modules; each platform page covers the part families and the design trade-offs we handle. Still comparing parts? Read how to choose a microcontroller.

Typical applications

Industrial IoT sensors
Ruggedized sensor nodes for factory monitoring, predictive maintenance, and process automation with long-range wireless connectivity.
Medical wearables
Compact, low-power health monitoring devices for continuous patient monitoring, designed to IEC 60601-1 and IEC 62304 requirements, with documentation structured for the manufacturer's ISO 13485 quality system.
Smart home devices
Wi-Fi/BLE enabled smart home controllers and sensors with voice assistant integration and cloud connectivity.
Automotive ECUs
Electronic control units for vehicle systems including ADAS, telematics, and battery management systems.

Process

How we work

Video poster: step 03, “Layout and analysis”, beside a routed 4-layer example board with an RF keep-out and the badge “DRC 0 · SI / PI checked”.

What a PCB design engagement hands you25 s · no sound

Video text
  1. PCB design & layout. Schematic to a DFM-checked fabrication package.
  2. 01 · Constraints and stackup: Stackup, impedance and fab limits agreed first. 4-layer example board, 1.0 mm: L1 Top, prepreg, L2 GND plane, core, L3 3V0 plane, prepreg, L4 Bottom.
  3. 02 · Schematic capture: Reviewed schematic and BOM. Design review passed.
  4. 03 · Layout and analysis: Placement, routing, then SI, power and EMC checks where needed. DRC 0 · SI / PI checked.
  5. 04 · DFM review and release: Fab and assembly package on one revision. Gerber / ODB++ · Drill files · BOM · Pick-and-place · Assembly drawings · DFM/DFA report.
  6. Up to 24 layers · HDI and microvias · Rigid-flex · RF and mixed-signal. Altium Designer · KiCad · Cadence Allegro/OrCAD · Siemens PADS.
  7. PCB design, typically 2–6 weeks per board. Rapid Circuitry. Discuss your product → rapidcircuitry.com/contact. Reply within one business day · Mutual NDA on request.
  8. Drawings: illustrative, example project.
  1. Architecture

    Resolve processor, sensing, power, interfaces and enclosure constraints together, against the next milestone.

    Deliverable: Architecture and interface decisions recorded before layout

  2. Schematic and PCB design

    Component selection, schematic and board layout with DFM, DFT and DFA reviews.

    Deliverable: Schematic, PCB layout and BOM

  3. Prototype and bring-up

    Inspect the assembly, check power rails and clocks, establish programming access, then exercise peripherals and interfaces.

    Deliverable: Bring-up records tied to hardware and firmware revisions

  4. Validation (EVT/DVT)

    Verification against the requirements, with EMC/EMI pre-compliance testing before formal certification.

    Deliverable: Test evidence against project-specific exit criteria

  5. Manufacturing handoff

    Separate the manufacturing release from the prototype demonstration and hand over the release package.

    Deliverable: Source design files, BOM and test evidence for production

Engineering notes

From board architecture to a validated hardware release

Embedded hardware development connects the product requirements to a buildable electronic design. Processor selection, sensing, power, interfaces and enclosure constraints need to be resolved together. The next milestone determines whether the work should produce a proof of concept, a validation prototype or a manufacturing release.

Board bring-up and hardware validation

Define the bring-up sequence before the first boards arrive: inspect the assembly, check power rails and clocks, establish programming access, then exercise peripherals and communication interfaces. Record board revision, firmware version, test conditions and unresolved faults so a successful bench demonstration can be reproduced.

Battery life and component selection

Choose an MCU or SoC against the actual workload, memory, interfaces and supply constraints. Estimate battery life from active, sleep and transmission duty cycles, then measure the assembled device. Radio retries, sensor settling, regulator losses and temperature can change the result; a low sleep-current specification alone does not establish product battery life.

Standards depend on the product and target market

Identify the applicable safety, EMC, radio and sector requirements before freezing the design. ISO 13485 addresses a medical-device quality management system; it is not an electrical test or blanket approval of a board. Agree the required product evidence, responsible organization and external laboratory scope with the compliance reviewer.

ISO: scope of ISO 13485

Key considerations

  • Architecture and interface decisions recorded before layout
  • EVT, DVT and PVT milestones defined with project-specific exit criteria
  • Board bring-up records tied to hardware and firmware revisions
  • Manufacturing release separated from prototype demonstration

Planning

Scope and cost

Start with a non-confidential summary of your product and the milestone you need to reach next.

What to include in an embedded hardware brief

Describe the product's use, environment, and next development milestone. A proof of concept, a validation prototype, and a manufacturing release require different scopes and evidence.

Inputs for your project brief

  • Use case, users, operating environment, and any existing prototype or requirements document.
  • Sensors, interfaces, connectivity, power source, size constraints, and target production volume.
  • Target markets, required tests, cost constraints, and the milestone the next stage must achieve.

Choose the scope for your next milestone

Agree the deliverables and acceptance criteria

Agree the architecture and design outputs, prototype responsibilities, verification plan, and manufacturing handoff. Identify separate laboratory, certification, tooling, and production costs before comparing proposals.

Agree confidentiality arrangements before sharing proprietary design files.

Planning guides

How to Choose a Microcontroller (MCU)

The eight factors that decide an MCU choice — performance, power, peripherals, connectivity, memory, ecosystem, supply and certification.

Drone and UAV Electronics Guide

Flight controller vs companion computer, ESCs, LiPo, hybrid and hydrogen power, India’s Drone Rules and type certification, costs and timelines.

Proof

Related case studies

19 more case studies

Automated Nitric Oxide Therapy System

Connected iNO Delivery for NICU Patients

Medical equipment manufacturer, India

Class C Firmware Design
IEC 62304
Dosing Accuracy (or ±0.5 ppm, whichever is greater)
±10%
Design target
Lower Device Cost vs Imported iNO Systems (BOM estimate)
60%
Design target
Review all case studies

FAQ

Frequently asked questions

What are embedded systems?

An embedded system is a specialized computer system designed to perform dedicated functions within a larger mechanical or electrical system. Unlike general-purpose computers, embedded systems are optimized for specific tasks, offering real-time performance, low power consumption, and compact form factors. Examples include automotive ECUs, medical monitoring devices, industrial controllers, and IoT sensors.

Source: Rapid Circuitry engineering team. Related terms: microcontroller, firmware, RTOS, SoC.

Weighing an external design team? Read our guide to outsourcing embedded hardware design.

Working with Rapid Circuitry

How much does a project cost, and how is pricing structured?

Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.

How long does a project take?

It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.

Who owns the intellectual property?

You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.

Do you sign NDAs?

Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.

Can you work with clients in the US, Europe and Japan?

Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.

Do you hand off to manufacturing, and which contract manufacturers do you work with?

Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.

Are you ISO 9001 or ISO 13485 certified?

No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.

What do you need from me to start?

A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.

Explore

Firmware development

Embedded C/C++ firmware on bare metal, an RTOS or embedded Linux: drivers, bring-up, secure boot and OTA updates.

PCB design

Schematic capture and layout up to 24 layers, including HDI, rigid-flex, RF and high-speed boards, with a DFM-checked fabrication package.

IoT solutions

Connected products from one team: sensor hardware, firmware, BLE, LoRaWAN or cellular connectivity, OTA updates and the cloud backend.