Engineering blog
Practical engineering articles on PCB design, embedded firmware, connected-device architecture, IoT protocols, edge AI, compliance, validation and production. Browse field-tested decisions from concept and component selection through manufacturing handoff.
17 of 17 articles
GaN bidirectional switches cut PCB footprint up to 82% in compact power and USB protection designs. 2026 guide to topology, layout, and thermal practice.
PCIe 6.0 PCB design guide for 2026: PAM4 signaling, FEC, channel loss budgets, stackup choices, and routing rules every Gen6 hardware team needs to know.
Single Pair Ethernet PCB design is replacing fieldbus in 2026. Learn 10BASE-T1S stackup, PLCA timing, multidrop topology, and PoDL layout best practices.
UWB PCB design guide for engineers building digital keys, asset trackers, and indoor positioning. Antenna placement, stackup, IEEE 802.15.4z, and DFM tips.
Satellite IoT hardware design in 2026: choose NTN modules, plan antennas, manage power, and integrate cellular fallback for global low-data IoT devices.
TinyML MCU hardware guide for 2026: compare NPU architectures, memory budgets, and power per inference for STM32N6, MSPM0G5187, and MAX78000 platforms.
Wi-Fi 7 PCB design for IoT in 2026 demands precise RF layout, antenna placement, and impedance control. Get the full hardware guide from Rapid Circuitry.
Cyber Resilience Act compliance is mandatory for IoT hardware sold in EU by Dec 2027. Get the 2026 roadmap: SBOM, secure boot, vulnerability handling.
HDI PCB design in 2026 demands tight microvia control and disciplined stackup planning. Learn microvia classes, IPC-2226 limits, DFM, and SI for IoT teams.
Understand 5G RedCap for IoT devices in 2026. Compare with LTE-M, NB-IoT, antenna designs, and PCB implications for hardware teams.
Learn how to design PCBs for edge AI workloads in 2026. Power delivery, thermal management, LPDDR5 routing, and HDI stackup strategies that ship.
How Rapid Circuitry achieved a 140–170 nA system sleep current in a BLE temperature logger using a custom power handling circuit and the Silicon Labs BGM220P.
Discover how edge computing enhances IoT performance by reducing latency and enabling real-time data processing. Learn about its impact on industries like autonomous vehicles, industrial automation, and smart cities.
Discover how AI integration in IoT is transforming industries like healthcare, manufacturing, and smart cities. Learn about AI-driven IoT solutions, their benefits, and real-world applications for improved decision-making and automation.
Discover how Design for Manufacturability (DFM) improves electronics manufacturing by reducing errors, optimizing production workflows, and lowering costs. Learn best practices for PCB layout, component selection, and supply chain management.
Explore the convergence of embedded systems and IoT, focusing on integrating custom hardware with scalable cloud platforms like AWS, Azure, and GCP. Learn about common challenges and discover actionable strategies for connecting devices to the cloud.
Discover how rapid prototyping is revolutionizing IoT innovation by reducing time-to-market, lowering costs, and enabling iterative development. Learn actionable strategies to transform your product development process.
New guides and engineering articles on PCB design, firmware and IoT, in your inbox.