Services
Hardware, firmware, PCB, cloud, and manufacturing support organized around the stage and technical risk of your product.
6 services
Schematic capture and layout up to 24 layers, including HDI, rigid-flex, RF and high-speed boards, with a DFM-checked fabrication package.
2–6 weeks per board
System architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation and manufacturing handoff.
3–18 months
Precision analog, mixed-signal and power circuits: sensor front ends, power supplies and battery management.
4–12 weeks
Embedded C/C++ firmware on bare metal, an RTOS or embedded Linux: drivers, bring-up, secure boot and OTA updates.
4–16 weeks
Connected products from one team: sensor hardware, firmware, BLE, LoRaWAN or cellular connectivity, OTA updates and the cloud backend.
3–12 months
Standard prototype boards up to 8 layers, fabricated and assembled through partner PCB fabs in 48–72 hours; complex multilayer, HDI or RF boards typically take 5–7 business days.
48–72 hours (standard boards)
4 services
RTL design, verification and timing closure for DSP, high-speed interfaces and edge-AI acceleration on AMD, Altera and Lattice FPGAs.
8–20 weeks
Antennas and RF front ends from sub-GHz to about 8 GHz, integrated and pre-scanned before radio certification.
6–12 weeks
BMS, GaN and SiC DC-DC converters, 48 V and 800 V systems, EV charging electronics and motor drives.
Scoped per project
On-device inference: feasibility on your target hardware, model porting and quantisation, and integration with the firmware.
8–16 weeks
3 services
Low-power, sealed wearables with ECG, PPG and SpO2 sensing, Bluetooth LE and companion-app SDKs.
8–16 weeks to prototype
Telematics control units, V2X modules, in-vehicle networking and secure OTA for connected vehicles.
12–24 weeks
Robot control electronics and software: motor control, ROS 2 integration, sensor fusion and functional-safety design.
12–24 weeks
4 services
Independent design reviews and audits, including takeover of stalled or failing projects.
1–2 weeks
Pre-compliance testing and certification support for electronic products — this helps identify design risks before formal assessment; it does not itself grant certification or regulatory approval.
1–16 weeks
DFM/DFA review, release packages, test strategy and pilot-build support for the move to a contract manufacturer.
Ongoing
Manufacturing and production support for electronic products — NPI, DFM/DFA and production-readiness through ramp.
Ongoing
4 services
Device APIs, provisioning, telemetry pipelines and companion-app backends for connected hardware.
8–16 weeks
Real-time IoT dashboards, fleet portals and customer web apps for connected products.
6–12 weeks
iOS, Android and cross-platform companion apps: BLE or Wi-Fi onboarding, device control, alerts and OTA update flows.
8–16 weeks
Device-to-cloud backends: provisioning, MQTT and API ingestion, time-series data, OTA coordination and fleet monitoring.
6–12 weeks
Case studies
Medical Wearable
US-based digital health startup
Industrial IoT
Steel manufacturer, India (3 plants)
Connected Fleet
Logistics and transportation company