Smart Urinometer
Automated ICU Urine Output Monitoring System with Real-Time Analytics
- Class B Firmware Design
- IEC 62304
- Volume Accuracy vs Gravimetric Reference
- ±1% / ±2 mL
- Design target
- Nursing Time Saved
- 40%
- Design target
Core hardware
Precision analog, mixed-signal and power circuit design for sensor front ends, power stages and battery systems, delivered as schematics, analysis reports and a BOM with alternates.
Every project is quoted as a fixed-scope proposal within 3–5 business days of a discovery call. Discuss your product
Smart Urinometer
Automated ICU Urine Output Monitoring System with Real-Time Analytics
Specifications
Capabilities
Specialized design of high-precision analog circuits including instrumentation amplifiers, sensor interfaces, and signal conditioning with ultra-low noise, high stability, and exceptional linearity for demanding applications.
Expert integration of analog and digital domains with careful attention to data conversion, signal integrity, ground loops, and noise isolation for optimal system performance in challenging environments.
Advanced power supply design including linear/switching regulators, battery management systems, energy harvesting, and power monitoring with emphasis on efficiency, thermal management, and reliability.
EMC design practice aimed at IEC 61000/CISPR 32 and FCC Part 15 limits: controlled impedance routing, filtering, shielding and grounding, verified by pre-compliance scans before formal testing.
24-bit sigma-delta ADC front ends with low-drift references, chopper-stabilized and auto-zero amplifiers; accuracy is budgeted and calibrated per application (typically 0.01–0.1 %).
Comprehensive circuit simulation and verification using LTspice, MATLAB, and ANSYS to validate performance across process variations, temperature extremes, and aging effects before prototyping.
Specialized design techniques for battery-powered and energy-harvesting applications with ultra-low power consumption, sleep modes, and power sequencing to maximize runtime and reliability.
Advanced thermal analysis and design optimization using computational fluid dynamics (CFD) simulation to ensure reliable operation across extreme temperature ranges and environmental conditions.
Process
Analyse the requirements, check technical feasibility and component availability, and agree the milestones.
Deliverable: Technical requirements document, project milestones and risk assessment
Detailed system design and component selection, with design review, signal-integrity and power analysis.
Deliverable: System architecture, schematic, PCB layout and firmware architecture
Prototype hardware fabrication and firmware development, with code reviews and hardware verification.
Deliverable: Prototype hardware, firmware codebase, test procedures and documentation
Functional, environmental and regulatory testing against the requirements.
Deliverable: Test results report, compliance documentation and release package
Planning
Start with a non-confidential summary of your product and the milestone you need to reach next.
Idea to mass production in six stages — feasibility, prototype, EVT, DVT, PVT and ramp — with durations, cost ranges, founder decisions, IP terms and pilot runs.
BMS, GaN/SiC DC-DC for 48 V to 800 V, EV chargers (IEC 61851, OCPP) and motor control: stages, test equipment, standards, costs and timelines.
PCB design pricing broken down by layer count, complexity, signal speed and turnaround — so you know what to expect before you quote.
Proof
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FAQ
We design a wide range of electronic systems including power supplies (AC-DC, DC-DC), motor drives, sensor interfaces, display systems, audio circuits, and mixed-signal systems. Our expertise covers analog, digital, and power electronics for consumer, industrial, and medical applications.
Thermal management starts at the schematic stage with component selection and power budget analysis. We use thermal simulation tools, implement heat sinking strategies, design for proper airflow, and select appropriate thermal interface materials. Designs are validated through thermal imaging and stress testing.
Yes, we design electronics for extended temperature ranges (-40°C to +85°C or beyond), high humidity, vibration, shock, and corrosive environments. This includes conformal coating, ruggedized connectors, proper sealing, and component derating for long-term reliability.
Use a single continuous ground plane, partition analog and digital placement so return currents do not cross, and route the ADC's digital lines only over the digital region; split planes are used only when the ADC vendor requires it. We keep dedicated analog and digital power rails with independent filtering, and route analog signals over unbroken ground away from high-speed digital traces.
Power supply efficiency optimization involves selecting switching regulator topologies with synchronous rectification, using low-RDS(on) MOSFETs and low-DCR inductors to minimize conduction losses, and tuning switching frequency to balance core losses against ripple requirements. We also implement dynamic voltage scaling and load-dependent mode switching (PWM to PFM at light loads) to keep efficiency high across the load range.
EMI mitigation combines PCB-level techniques like continuous ground planes and strategic decoupling capacitor placement with board-level shielding using stamped metal cans or conductive gaskets over noisy sections. We design pi-filter networks on I/O lines, use common-mode chokes on differential pairs, and apply ferrite beads on power rails, validating compliance against FCC, CISPR 32, or automotive CISPR 25 limits.
Design for Testability incorporates test access points, boundary scan (JTAG) chains, and built-in self-test circuits into a PCB design to enable efficient fault detection during manufacturing. We add test pads on critical nets for ICT fixture probing, include LED indicators and serial debug headers, and design bed-of-nails-compatible pad layouts for automated test equipment.
Component selection starts with defining environmental requirements and reliability targets, then evaluating parts against automotive (AEC-Q), industrial, or mil-spec qualification levels as needed. We prioritize components with multiple qualified sources to mitigate supply chain risk, verify parametric data against application conditions rather than relying on typical datasheet values, and maintain an approved vendor list with lifecycle status monitoring.
Schematic capture begins with hierarchical block-level architecture defining power domains, signal interfaces, and functional subsystems, followed by detailed circuit entry with enforced net naming conventions and component library standards. We conduct formal design reviews at both the block diagram and detailed schematic stages, using checklists covering power budgets, decoupling strategy, ESD protection, signal integrity, and thermal analysis.
Analog signal conditioning circuits amplify, filter, and linearize raw sensor signals before digitization, using instrumentation amplifiers for differential inputs, active anti-aliasing filters matched to ADC sampling rates, and precision voltage references for stable measurement baselines. We calculate noise budgets from sensor through to ADC LSB and implement calibration routines to compensate for gain drift and offset errors over temperature.
BMS design encompasses cell voltage monitoring with millivolt-level accuracy using dedicated ICs, cell balancing (passive or active), and coulomb counting combined with voltage-based state-of-charge estimation algorithms. We implement multi-level protection including hardware-driven overcurrent, overvoltage, undervoltage, and overtemperature cutoffs independent of the microcontroller, plus firmware-level state-of-health tracking and predictive capacity fade modeling.
Design for manufacturing involves selecting standard package sizes compatible with pick-and-place machines, maintaining consistent component orientation for AOI, and designing panelized PCBs with breakaway tabs and fiducial markers. We work closely with contract manufacturers to align pad geometries with their capabilities, minimize unique part numbers, and create comprehensive assembly documentation including interactive BOMs and 3D assembly models.
Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.
It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.
You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.
Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.
Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.
Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.
No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.
A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.
Explore
Schematic capture and layout up to 24 layers, including HDI, rigid-flex, RF and high-speed boards, with a DFM-checked fabrication package.
System architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation and manufacturing handoff.
Antennas and RF front ends from sub-GHz to about 8 GHz, integrated and pre-scanned before radio certification.