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Specialised engineering

RF Design Services

RF and antenna design for teams building wireless products, from sub-GHz to about 8 GHz: custom antennas, RF front-end circuits (LNAs, PAs, filters and impedance matching), cellular, GNSS, Wi-Fi, Bluetooth, UWB and LoRa integration, simulation and tuning support, with pre-scans and certification testing at accredited partner labs for FCC, CE and ETSI requirements.

Quick answer

What we build
RF and antenna design from sub-GHz to about 8 GHz: custom antennas, RF front ends (LNAs, PAs, filters and impedance matching), cellular, GNSS, Wi-Fi, Bluetooth, UWB and LoRa integration, simulation and tuning support, with pre-scans and certification testing at accredited partner labs.
Who it is for
Teams building wireless products that need a custom antenna or RF front end, or a radio design ready for regulatory testing.
Typical timeline
6–12 weeks
Typical cost
RF scope typically adds $500–$3,000 to a board design at India-band rates; a full custom antenna with EM simulation and tuning support sits at the top of that range or above. Source: PCB design cost guide.
Designed to
FCC, CE (RED) and ETSI radio requirements.

Every project is quoted as a fixed-scope proposal within 3–5 business days of a discovery call. Discuss your product

Standards

  • FCC
  • CE
  • ETSI

Capabilities

What we deliver

Antenna design

Custom antenna design from sub-GHz to about 8 GHz, including PCB trace, chip, patch and dipole antennas, with 3D EM simulation of the radiation pattern in your enclosure.

RF circuit design

RF circuit design including LNAs, PAs, SAW/BAW filters, and impedance matching for low VSWR.

Wireless system integration

Wireless system integration for LTE-M/NB-IoT and 4G/5G modules, GNSS, Wi-Fi 6/6E, Bluetooth LE 5.x/6.x, UWB and LoRa.

Radio and EMC pre-compliance

Design for FCC, CE (RED) and ETSI requirements, with radiated pre-scans and certification testing at accredited partner labs.

Signal integrity

Controlled-impedance RF routing, S-parameter simulation and transmission-line design, coordinated with the board's high-speed digital layout.

RF tuning and test support

Antenna matching and tuning support during bring-up, and test plans for conducted and radiated measurements (output power, EVM, spurious emissions) made at accredited partner labs.

Capabilities and deliverables

Design capabilities

  • 3D EM simulation of antennas and RF structures
  • Power and efficiency optimization
  • Mixed-signal RF system design

Applications

  • Sub-GHz to 8 GHz products
  • Cellular, GNSS, Wi-Fi and Bluetooth products
  • UWB and BLE positioning systems

Process

How we work

  1. Requirements and planning

    Analyse the requirements, check technical feasibility and component availability, and agree the milestones.

    Deliverable: Technical requirements document, project milestones and risk assessment

  2. Design and architecture

    Detailed system design and component selection, with design review, signal-integrity and power analysis.

    Deliverable: System architecture, schematic, PCB layout and firmware architecture

  3. Implementation

    Prototype hardware fabrication and firmware development, with code reviews and hardware verification.

    Deliverable: Prototype hardware, firmware codebase, test procedures and documentation

  4. Validation and testing

    Functional, environmental and regulatory testing against the requirements.

    Deliverable: Test results report, compliance documentation and release package

Planning

Scope and cost

Start with a non-confidential summary of your product and the milestone you need to reach next.

Planning guides

LoRaWAN vs NB-IoT vs LTE-M

Low-power IoT connectivity compared across range, power, bandwidth, cost and mobility — with a decision framework for choosing the right protocol.

TWS Earbud and Audio Electronics Guide

SoC platforms, ANC/ENC, antennas in tiny enclosures, charging cases, LE Audio, certification, costs and the legal side of re-engineering.

Proof

Related case studies

Review all case studies

FAQ

Frequently asked questions

Working with Rapid Circuitry

How much does a project cost, and how is pricing structured?

Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.

How long does a project take?

It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.

Who owns the intellectual property?

You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.

Do you sign NDAs?

Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.

Can you work with clients in the US, Europe and Japan?

Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.

Do you hand off to manufacturing, and which contract manufacturers do you work with?

Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.

Are you ISO 9001 or ISO 13485 certified?

No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.

What do you need from me to start?

A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.

Explore

PCB design

Schematic capture and layout up to 24 layers, including HDI, rigid-flex, RF and high-speed boards, with a DFM-checked fabrication package.

Electronics design

Precision analog, mixed-signal and power circuits: sensor front ends, power supplies and battery management.

Embedded hardware development

System architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation and manufacturing handoff.