Multi-Connectivity Pet Tracker
Multi-Network GPS Tracking with BLE, LTE-M/NB-IoT & LoRa
- BLE, LTE-M, NB-IoT, LoRa
- 4 Networks
- Battery Life
- 45 Days
- Design target
- GPS Accuracy (open sky)
- 3m
- Design target
Specialised engineering
RF and antenna design for teams building wireless products, from sub-GHz to about 8 GHz: custom antennas, RF front-end circuits (LNAs, PAs, filters and impedance matching), cellular, GNSS, Wi-Fi, Bluetooth, UWB and LoRa integration, simulation and tuning support, with pre-scans and certification testing at accredited partner labs for FCC, CE and ETSI requirements.
Every project is quoted as a fixed-scope proposal within 3–5 business days of a discovery call. Discuss your product
Multi-Connectivity Pet Tracker
Multi-Network GPS Tracking with BLE, LTE-M/NB-IoT & LoRa
Standards
Capabilities
Custom antenna design from sub-GHz to about 8 GHz, including PCB trace, chip, patch and dipole antennas, with 3D EM simulation of the radiation pattern in your enclosure.
RF circuit design including LNAs, PAs, SAW/BAW filters, and impedance matching for low VSWR.
Wireless system integration for LTE-M/NB-IoT and 4G/5G modules, GNSS, Wi-Fi 6/6E, Bluetooth LE 5.x/6.x, UWB and LoRa.
Design for FCC, CE (RED) and ETSI requirements, with radiated pre-scans and certification testing at accredited partner labs.
Controlled-impedance RF routing, S-parameter simulation and transmission-line design, coordinated with the board's high-speed digital layout.
Antenna matching and tuning support during bring-up, and test plans for conducted and radiated measurements (output power, EVM, spurious emissions) made at accredited partner labs.
Process
Analyse the requirements, check technical feasibility and component availability, and agree the milestones.
Deliverable: Technical requirements document, project milestones and risk assessment
Detailed system design and component selection, with design review, signal-integrity and power analysis.
Deliverable: System architecture, schematic, PCB layout and firmware architecture
Prototype hardware fabrication and firmware development, with code reviews and hardware verification.
Deliverable: Prototype hardware, firmware codebase, test procedures and documentation
Functional, environmental and regulatory testing against the requirements.
Deliverable: Test results report, compliance documentation and release package
Planning
Start with a non-confidential summary of your product and the milestone you need to reach next.
Low-power IoT connectivity compared across range, power, bandwidth, cost and mobility — with a decision framework for choosing the right protocol.
Compare the five wireless protocols that matter in IoT — range, power, topology and best-fit use cases — with a decision framework.
SoC platforms, ANC/ENC, antennas in tiny enclosures, charging cases, LE Audio, certification, costs and the legal side of re-engineering.
Proof
Multi-Connectivity Pet Tracker
European pet technology company
BLE Beacon RTLS
Asset-tracking client, Dubai, UAE
UWB Asset Tracker
Warehouse-technology company, Bangalore, India
Smart Police Wearable
State police department, India
FAQ
Our delivered radio designs span sub-GHz to about 8 GHz: sub-GHz bands (433 MHz, EU 868 MHz SRD, US 915 MHz ISM, India 865-867 MHz), 2.4 GHz and 5 GHz ISM, cellular (LTE-M/NB-IoT, LTE, 5G NR sub-6 GHz), GPS/GNSS, Wi-Fi 6/6E, Bluetooth, LoRa and UWB. Millimetre-wave (24 GHz and above) work is not part of our delivered-project record, so we scope it case by case.
We design for the regulatory requirements from the start, including filtering, spurious emission control and antenna design. Radiated pre-scans and certification testing are carried out at accredited partner labs before and during formal FCC, CE (RED), ISED and other certifications.
Yes, we design custom antennas including PCB trace antennas, chip antennas, ceramic antennas, and external antenna systems. Antenna designs are optimized for your specific enclosure, frequency bands, and radiation pattern requirements using electromagnetic simulation tools.
RF design, EM simulation and tuning support are done by our team. We do not operate our own RF chamber: radiated pre-scans, antenna-pattern and over-the-air measurements, and certification testing are carried out at accredited partner labs, and we prepare the test plans and interpret the results with you.
An RF front-end module integrates the low-noise amplifier, power amplifier, filters, switches, and matching networks between the antenna and the transceiver IC, with the primary design challenge being minimizing insertion loss while maintaining sufficient out-of-band rejection and linearity. Component selection must balance noise figure, gain, IP3 linearity, and power consumption within the system link budget.
Antenna matching network optimization uses vector network analyzer measurements of the antenna's complex impedance across the operating bandwidth, then designs an L, Pi, or T network to transform that impedance to the 50-ohm system reference with minimal loss. Final optimization requires iterating on component values with production-tolerance Monte Carlo analysis, since parasitic inductance and capacitance of physical SMD components shift the match from ideal calculations, especially above 2 GHz.
RF interference mitigation combines shielding, filtering, physical separation, and grounding strategies tailored to the specific coupling mechanism. Board-level techniques include isolating RF sections with ground-stitched shield fences, routing sensitive traces on inner layers between ground planes, and using ferrite beads on power supply lines. System-level strategies such as frequency planning and spread-spectrum clocking address interference that board-level measures alone cannot eliminate.
Wireless coexistence testing evaluates how multiple radio technologies like Wi-Fi, Bluetooth, LTE, and GPS perform when operating simultaneously within the same device, measuring desensitization, throughput degradation, and latency impact caused by inter-radio interference. Failing to perform coexistence testing is one of the most common causes of post-launch performance complaints, as issues only manifest when all radios operate concurrently under real-world conditions.
RF power amplifier design centers on achieving the required output power and efficiency while maintaining linearity measured by EVM and ACLR for modulated signals. The bias class (A, AB, B, C) and the efficiency architecture (Doherty, envelope tracking) determine the efficiency-linearity tradeoff, with modern handset PAs using envelope tracking to achieve 40 to 50 percent efficiency with complex modulation schemes like 256-QAM OFDM.
Software-defined radio replaces fixed analog RF processing with wideband digitization using high-speed ADCs and DACs positioned close to the antenna, moving channel selection, filtering, and demodulation into digital signal processing on FPGAs or DSPs. Transceivers such as the Analog Devices AD9361 (70 MHz to 6 GHz, 2x2) and AD9371 (300 MHz to 6 GHz, 2x2) integrate dual-channel RF front ends, providing a complete analog front-end for custom waveform implementation.
5G mmWave design faces severe path loss requiring phased-array antennas, from 4-8 elements in handset modules to 64-256 or more in base stations, and beamforming to maintain viable link budgets. PCB material selection becomes critical above 10 GHz, necessitating low-loss laminates like Rogers RO4835 with tightly controlled dielectric properties. Component packaging transitions to antenna-in-package modules where the phased array and beamforming ICs are co-integrated to minimize interconnect losses.
Modern RF design relies on 3D full-wave solvers like Ansys HFSS and CST Studio Suite for antenna and package modeling, 2.5D planar solvers like Keysight ADS Momentum for PCB structures, and circuit-level simulators like Keysight ADS and Cadence AWR for system-level cascaded analysis. Co-simulation workflows link these tools so EM-extracted parasitic models feed directly into circuit simulations for accurate real-world performance prediction.
Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.
It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.
You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.
Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.
Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.
Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.
No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.
A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.
Explore
Schematic capture and layout up to 24 layers, including HDI, rigid-flex, RF and high-speed boards, with a DFM-checked fabrication package.
Precision analog, mixed-signal and power circuits: sensor front ends, power supplies and battery management.
System architecture, MCU/SoC selection, schematic and PCB design, board bring-up, validation and manufacturing handoff.