MIL-STD-810H
Environmental engineering
Test methods tailored to your platform's life-cycle environmental profile; qualification testing at accredited labs.
Industries
We design rugged embedded compute, FPGA boards, power conditioning, and telemetry and datalink hardware for aerospace and defense programmes, designed to MIL-STD-810H, MIL-STD-461G and MIL-STD-704/1275 requirements and built to IPC Class 3. For airborne programmes we develop hardware and software to support DO-254 and DO-178C objectives; export-controlled data is handled only under the client's export authorisation.
What we build
Electronics designed to tailored MIL-STD-810H methods (500 altitude, 501/502 temperature, 507 humidity, 509 salt fog, 514 vibration, 516 shock), with military-temperature (–55 °C to +125 °C) components and conformal coating where required.
FPGA and board-level airborne hardware developed to support DO-254 objectives on customer programmes: plans, requirements capture, verification and configuration management for the DAL set by your system safety assessment. Compliance is found by the certification authority.
Controlled access, encrypted data handling and NDA-protected IP. ITAR-controlled technical data can be shared with us only under a US export authorisation (e.g. a DSP-5 licence or TAA) that the client obtains; for Indian programmes we follow SCOMET and MoD requirements.
IPC-6012 / IPC-A-610 Class 3 PCB design with laminates qualified to IPC-4101/4103 slash sheets (e.g. Rogers, Isola), plated via-in-pad, heavy copper for power-dense circuits, controlled impedance, and qualification testing support.
RF front-ends, datalink and telemetry hardware and antenna integration for secure communication systems, with pre-scan and qualification testing at accredited partner labs.
Wide-temperature-range power supply and power conditioning hardware for airborne, shipborne and ground-vehicle platforms, designed to MIL-STD-704 and MIL-STD-1275 power-input requirements and MIL-STD-461 EMI limits, tested at accredited labs.
Applications
Standards
Environmental engineering
Test methods tailored to your platform's life-cycle environmental profile; qualification testing at accredited labs.
EMI / EMC
Conducted and radiated emission and susceptibility limits designed in from the schematic, with pre-scans before the qualification campaign.
Power input
Aircraft (704) and military ground-vehicle (1275) power-input characteristics, including transients and surges, designed into the power front end.
Airborne hardware and software
Development to support DO-254 hardware and DO-178C software objectives on customer programmes, for the DAL or software level set by your safety assessment. Compliance is found by the certification authority (FAA, EASA or CEMILAC).
Airborne equipment environment
Environmental and EMC test categories for airborne equipment, designed for and tested at accredited labs.
High-reliability build
Class 3 fabrication and assembly requirements, with MIL-PRF-31032 or MIL-PRF-55110 specified on the fabrication drawing for QML-qualified fabricators.
How we work
System requirements, DAL or software level, environmental profile and export-control status agreed with your programme.
Hardware and software plans and configuration management set up to support your programme's DO-254/DO-178C objectives.
Schematic, Class 3 PCB, FPGA and firmware with requirements traceability.
Requirements-based testing, environmental and EMI pre-scans, and qualification testing (MIL-STD-810H, MIL-STD-461G, DO-160G) at accredited partner labs.
The data package for your approved or QML-qualified fabricator and the evidence for your certification liaison.
Proof
Hydrogen Drone Power System
Hydrogen-powertrain venture in which our founder is CTO (related party)
FAQ
Yes. We design electronics to MIL-STD-810H environmental standards covering shock (Method 516), vibration (Method 514), temperature extremes (Methods 501/502), humidity (Method 507), and altitude (Method 500).
We develop FPGA and board-level hardware following DO-254 processes (PHAC, requirements, verification, configuration management) for the DAL set by your system safety assessment, and firmware to support DO-178C objectives for the assigned software level. Compliance is found by the certification authority (FAA, EASA, or CEMILAC for Indian military programmes); we do not claim it for a design.
ITAR-controlled technical data can be shared with us only under a US export authorisation (e.g. a DSP-5 licence or a Technical Assistance Agreement) obtained by the US exporter; the client handles that authorisation and we do not accept controlled data without one. Once authorised, we apply access controls, NDAs and secure development environments. For Indian programmes we follow SCOMET export-control and MoD requirements.
We design to IPC-6012 and IPC-A-610 Class 3 requirements for high-reliability electronics, use laminates qualified to IPC-4101/4103 slash sheets (e.g. Rogers, Isola), apply conformal coating, and specify MIL-PRF-31032 or MIL-PRF-55110 on the fabrication drawing for QML-qualified fabricators.
We design RF front-ends and datalink hardware for secure communication systems. What we can take on depends on the project scope and the applicable export-control authorisations.
Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.
It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.
You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.
Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.
Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.
Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.
No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.
A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.
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