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Industries

Aerospace & Defense Electronics

We design rugged embedded compute, FPGA boards, power conditioning, and telemetry and datalink hardware for aerospace and defense programmes, designed to MIL-STD-810H, MIL-STD-461G and MIL-STD-704/1275 requirements and built to IPC Class 3. For airborne programmes we develop hardware and software to support DO-254 and DO-178C objectives; export-controlled data is handled only under the client's export authorisation.

  • MIL-STD-810H
  • MIL-STD-461G
  • DO-254 · DO-178C
  • IPC Class 3

What we build

Key capabilities

MIL-STD-810 ruggedized electronics

Electronics designed to tailored MIL-STD-810H methods (500 altitude, 501/502 temperature, 507 humidity, 509 salt fog, 514 vibration, 516 shock), with military-temperature (–55 °C to +125 °C) components and conformal coating where required.

DO-254 avionics hardware

FPGA and board-level airborne hardware developed to support DO-254 objectives on customer programmes: plans, requirements capture, verification and configuration management for the DAL set by your system safety assessment. Compliance is found by the certification authority.

Export-controlled programmes

Controlled access, encrypted data handling and NDA-protected IP. ITAR-controlled technical data can be shared with us only under a US export authorisation (e.g. a DSP-5 licence or TAA) that the client obtains; for Indian programmes we follow SCOMET and MoD requirements.

High-reliability PCB design

IPC-6012 / IPC-A-610 Class 3 PCB design with laminates qualified to IPC-4101/4103 slash sheets (e.g. Rogers, Isola), plated via-in-pad, heavy copper for power-dense circuits, controlled impedance, and qualification testing support.

RF & datalink hardware

RF front-ends, datalink and telemetry hardware and antenna integration for secure communication systems, with pre-scan and qualification testing at accredited partner labs.

Power electronics for defense

Wide-temperature-range power supply and power conditioning hardware for airborne, shipborne and ground-vehicle platforms, designed to MIL-STD-704 and MIL-STD-1275 power-input requirements and MIL-STD-461 EMI limits, tested at accredited labs.

Applications

Industry applications

Avionics

  • Data acquisition units
  • Navigation and telemetry hardware
  • Display and interface electronics
  • Rugged embedded compute

Defense Systems

  • Sensor interface electronics
  • FPGA signal-processing boards
  • Datalink and communication units
  • Power conditioning modules

Ground & Naval

  • Ruggedized vehicle electronics
  • Naval shipborne systems
  • Ground station hardware
  • Unmanned system electronics

Standards

Standards we design to

MIL-STD-810H

Environmental engineering

Test methods tailored to your platform's life-cycle environmental profile; qualification testing at accredited labs.

MIL-STD-461G

EMI / EMC

Conducted and radiated emission and susceptibility limits designed in from the schematic, with pre-scans before the qualification campaign.

MIL-STD-704F · MIL-STD-1275E

Power input

Aircraft (704) and military ground-vehicle (1275) power-input characteristics, including transients and surges, designed into the power front end.

DO-254 · DO-178C

Airborne hardware and software

Development to support DO-254 hardware and DO-178C software objectives on customer programmes, for the DAL or software level set by your safety assessment. Compliance is found by the certification authority (FAA, EASA or CEMILAC).

DO-160G

Airborne equipment environment

Environmental and EMC test categories for airborne equipment, designed for and tested at accredited labs.

IPC-6012 · IPC-A-610 Class 3

High-reliability build

Class 3 fabrication and assembly requirements, with MIL-PRF-31032 or MIL-PRF-55110 specified on the fabrication drawing for QML-qualified fabricators.

How we work

How an aerospace or defense project runs

  1. Requirements

    System requirements, DAL or software level, environmental profile and export-control status agreed with your programme.

  2. Plans

    Hardware and software plans and configuration management set up to support your programme's DO-254/DO-178C objectives.

  3. Design

    Schematic, Class 3 PCB, FPGA and firmware with requirements traceability.

  4. Verification

    Requirements-based testing, environmental and EMI pre-scans, and qualification testing (MIL-STD-810H, MIL-STD-461G, DO-160G) at accredited partner labs.

  5. Transfer

    The data package for your approved or QML-qualified fabricator and the evidence for your certification liaison.

Proof

Case studies

Hydrogen Drone Power System

5 kW Fuel-Cell Powerpack Integration, Thermal and Mass Study

Hydrogen-powertrain venture in which our founder is CTO (related party)

Status: no flight hardware yet
Design study
Air-cooled PEM fuel-cell stack
5 kW
Target MTOW and endurance
35 kg / 60 min
Design target
Review all case studies

FAQ

Frequently asked questions

Working with Rapid Circuitry

How much does a project cost, and how is pricing structured?

Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.

How long does a project take?

It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.

Who owns the intellectual property?

You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.

Do you sign NDAs?

Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.

Can you work with clients in the US, Europe and Japan?

Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.

Do you hand off to manufacturing, and which contract manufacturers do you work with?

Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.

Are you ISO 9001 or ISO 13485 certified?

No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.

What do you need from me to start?

A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.

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