Medical device development
Class I and II device electronics and Class III subsystems, designed to ISO 13485, IEC 62304 and IEC 60601-1 requirements, with documentation support for FDA 510(k), De Novo or PMA and CE technical files.
Industries
Engineering for Connected Products, by Industry
Medical, industrial, automotive, aerospace, consumer and IoT systems engineered from architecture through certification readiness and production handoff.
Industries we engineer for
Connected hardware and software designed to the regulatory, reliability and performance requirements of your industry.
Healthcare IoT solutions
Remote patient monitoring, medical-device integration over HL7 FHIR and health-data pipelines, with data handling designed to support your HIPAA Security Rule obligations.
Industrial automation
Predictive-maintenance sensors, edge gateways and SCADA/HMI interfaces over OPC UA, Modbus and MQTT, designed to IEC 62443 and IEC 61508 requirements where they apply.
Automotive electronics
EV battery management, ADAS sensor interfaces, telematics and ECU hardware and firmware designed to ISO 26262 requirements, with AUTOSAR-based software integration where the programme needs it.
Consumer electronics
TWS earbuds and audio, consumer wearables and smart-home devices, designed for unit cost, volume production and FCC, CE, BIS and WPC certification.
Aerospace & defense
Rugged electronics designed to MIL-STD-810H and MIL-STD-461G requirements, and avionics hardware and software developed to support DO-254/DO-178C objectives on customer programmes.
Drones & UAVs
Flight-controller, power-distribution, hybrid and hydrogen power, telemetry and payload electronics for unmanned aircraft.
Energy & utilities IoT
Smart-grid monitoring, smart metering and substation hardware for generation and distribution, with IEC 61850, DLMS/COSEM and IEC 60870-5-104 interfaces.
Programmes for any industry
Prototype builds, complex PCB engineering and products sold under your own brand.
White-label and ODM products
White-label and ODM IoT products for brands without in-house engineering teams. We design the product and prepare the manufacturing package; partner fabs or your contract manufacturer build it.
Rapid prototyping
48–72 hour turnaround for standard prototype boards up to 8 layers, fabricated and assembled through partner PCB fabs; complex multilayer, HDI or RF boards typically take 5–7 business days. Firmware bring-up, enclosure prototypes and testing are scheduled alongside.
Complex PCB engineering
PCB engineering up to 24 layers, HDI and rigid-flex for high-speed digital, mixed-signal and RF designs, with controlled impedance, signal-integrity checks and IPC-based design rules.