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Complex PCB Engineering for Electronic Products

System-level engineering for products that combine processors, high-speed memory and interfaces, RF, precision analog and power: boards up to 24 layers, HDI and rigid-flex, designed to IPC-2221/2222 and IPC-7351 and built to IPC-6012 and IPC-A-610. We resolve architecture, stackup, signal and power integrity, EMC and manufacturing risks before they become board respins. For standalone layout delivery, see our dedicated PCB design service.

  • Up to 24 layers
  • HDI and rigid-flex
  • DDR, PCIe, USB
  • RF and mixed-signal
  • IPC-2221 · IPC-6012 · IPC-A-610

What we build

What we engineer

Multilayer, HDI and rigid-flex

Boards up to 24 layers, HDI with microvias and blind/buried vias, and rigid-flex, with the stackup and impedance agreed with the fab before layout.

High-speed digital

DDR3/DDR4/LPDDR4, PCIe, USB and Ethernet routing with controlled impedance, length matching and pre- and post-layout signal-integrity checks.

RF and wireless

RF layout, antenna integration, matching networks and shielding for BLE, Wi-Fi, cellular and GNSS, with pre-scan and certification testing at accredited partner labs.

Power integrity and thermal

Power-tree design, decoupling and plane planning, current-carrying capacity and thermal management for dense boards.

EMC/EMI design

Stackup, return paths, partitioning and filtering designed for EMC from the start, prepared for accredited-lab testing.

Mixed-signal and precision analog

Analog and digital partitioning, grounding and reference routing for precision measurement and sensor front ends next to processors and switching supplies.

1 more capability

DFM and production design review

Design-for-manufacturing and assembly review, and the fabrication and assembly drawings your fab and contract manufacturer build from.

Applications

Areas of expertise

Digital design

  • High-speed interfaces (USB, PCIe, Ethernet)
  • DDR3/4 and LPDDR4 memory routing
  • Microprocessor and FPGA boards
  • Clock distribution networks

RF and wireless

  • Wireless communication circuits
  • Antenna design and integration
  • RF shielding and isolation
  • Impedance matching networks

Power design

  • Power supply and regulation
  • Battery management systems
  • Power integrity analysis
  • Thermal management

Standards

Design and build standards

IPC-2221 · IPC-2222

Board design

Generic and rigid-board design requirements: conductor sizing, spacing, holes and annular rings, for the product's performance class.

IPC-7351

Land patterns

Footprints built to IPC-7351 land-pattern rules for reliable assembly and inspection.

IPC-6012

Bare-board fabrication

Class 2 or Class 3 fabrication requirements specified on the fabrication drawing, with the automotive (IPC-6012DA) addendum where needed.

IPC-A-610

Assembly acceptability

Class 2 or Class 3 assembly acceptance criteria specified for the contract manufacturer.

How we work

How a PCB engineering project runs

  1. Requirements analysis

    Specifications, interfaces, constraints and the target cost and volume.

  2. Architecture and stackup

    Board partitioning, layer count, stackup and impedance agreed with the fab.

  3. Schematic design

    Circuit design, component selection and simulation where it reduces risk.

  4. PCB layout

    Placement and routing with signal-integrity, power-integrity and EMC constraints.

  5. Design verification and DFM

    Design review against requirements, DFM checks and the fabrication and assembly package.

  6. Prototype and production support

    Bring-up support, and fixes carried into the manufacturing release.

FAQ

PCB engineering FAQs

Working with Rapid Circuitry

How much does a project cost, and how is pricing structured?

Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.

How long does a project take?

It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.

Who owns the intellectual property?

You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.

Do you sign NDAs?

Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.

Can you work with clients in the US, Europe and Japan?

Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.

Do you hand off to manufacturing, and which contract manufacturers do you work with?

Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.

Are you ISO 9001 or ISO 13485 certified?

No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.

What do you need from me to start?

A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.

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