IPC-2221 · IPC-2222
Board design
Generic and rigid-board design requirements: conductor sizing, spacing, holes and annular rings, for the product's performance class.
Industries
System-level engineering for products that combine processors, high-speed memory and interfaces, RF, precision analog and power: boards up to 24 layers, HDI and rigid-flex, designed to IPC-2221/2222 and IPC-7351 and built to IPC-6012 and IPC-A-610. We resolve architecture, stackup, signal and power integrity, EMC and manufacturing risks before they become board respins. For standalone layout delivery, see our dedicated PCB design service.
What we build
Boards up to 24 layers, HDI with microvias and blind/buried vias, and rigid-flex, with the stackup and impedance agreed with the fab before layout.
DDR3/DDR4/LPDDR4, PCIe, USB and Ethernet routing with controlled impedance, length matching and pre- and post-layout signal-integrity checks.
RF layout, antenna integration, matching networks and shielding for BLE, Wi-Fi, cellular and GNSS, with pre-scan and certification testing at accredited partner labs.
Power-tree design, decoupling and plane planning, current-carrying capacity and thermal management for dense boards.
Stackup, return paths, partitioning and filtering designed for EMC from the start, prepared for accredited-lab testing.
Analog and digital partitioning, grounding and reference routing for precision measurement and sensor front ends next to processors and switching supplies.
Design-for-manufacturing and assembly review, and the fabrication and assembly drawings your fab and contract manufacturer build from.
Applications
Standards
Board design
Generic and rigid-board design requirements: conductor sizing, spacing, holes and annular rings, for the product's performance class.
Land patterns
Footprints built to IPC-7351 land-pattern rules for reliable assembly and inspection.
Bare-board fabrication
Class 2 or Class 3 fabrication requirements specified on the fabrication drawing, with the automotive (IPC-6012DA) addendum where needed.
Assembly acceptability
Class 2 or Class 3 assembly acceptance criteria specified for the contract manufacturer.
How we work
Specifications, interfaces, constraints and the target cost and volume.
Board partitioning, layer count, stackup and impedance agreed with the fab.
Circuit design, component selection and simulation where it reduces risk.
Placement and routing with signal-integrity, power-integrity and EMC constraints.
Design review against requirements, DFM checks and the fabrication and assembly package.
Bring-up support, and fixes carried into the manufacturing release.
FAQ
As planning ranges for the design fee per board at Rapid Circuitry: $2,000–$5,000 for a simple 2–4 layer board, $4,000–$8,000 for a 4–6 layer high-speed board, and $10,000–$25,000+ for an 8+ layer HDI, RF or mixed-signal board. Layout typically takes 2–6 weeks per board. The fixed-scope proposal replaces the range once the requirements are known.
We design boards up to 24 layers, including HDI with microvias and blind/buried vias, and rigid-flex. Quick-turn prototype builds through our partner PCB fabs are a separate limit: 48–72 hours for standard boards up to 8 layers, while complex multilayer, HDI or RF boards typically take 5–7 business days to build.
IPC-2221 and IPC-2222 for board design, IPC-7351 for land patterns, and we specify IPC-6012 fabrication and IPC-A-610 assembly acceptance at Class 2 or Class 3 on the fabrication and assembly drawings.
No design can guarantee a pass, but EMC is designed in from the stackup onwards: return paths, partitioning, filtering and shielding. We prepare the board for pre-scan and certification testing at accredited partner labs, and fix any margin problems before the formal campaign.
Each project is quoted as a fixed-scope proposal: a statement of work with milestones, deliverables and pricing, sent within 3–5 business days of the discovery call. The price depends on the requirements, how mature the design is, technical complexity, the number of prototype iterations and the validation scope. Longer engagements can also run as a retainer or a hybrid of both. For budgeting before you contact us, our hardware development cost benchmarks and the PCB design, firmware and IoT cost guides give indicative ranges with their assumptions stated. They are planning ranges, not quotes.
It depends on the scope and on what already exists when we start. As planning ranges from our cost benchmarks: a single PCB layout takes 2–6 weeks per board and embedded firmware 4–16 weeks. A connected (IoT) product takes 3–12 months from concept to a production-ready design, and a regulated medical device 12–24 months to a 510(k) submission-ready package; from idea to mass production, a typical connected product takes 9–18 months. The proposal sets out a dated milestone plan, and you receive weekly progress updates during the project.
You do. Our contracts assign the intellectual property in the project work product (schematics, PCB design files, firmware source code and documentation) to you on payment, and we hand over the source files, not only fabrication outputs or compiled binaries. The exact terms are set out in the signed agreement for each engagement.
Yes. We sign a mutual NDA before any technical discussion of your project. Send your standard NDA or use ours; we return it signed within one business day.
Yes. We are based in Hyderabad, India, and work with product teams in India, the United States, the United Kingdom, Germany, Japan, Australia, the Middle East and other markets. Our office hours are 10:30–19:00 India Standard Time (UTC+5:30), Monday to Saturday, and we schedule design reviews across time zones, typically from US Pacific to Central European time. Japan is 3.5 hours ahead of India, so our first four hours overlap the Japanese afternoon. Prototypes and documentation ship by international courier such as DHL or FedEx. Our hardware outsourcing guide covers what to agree before an international project starts.
Yes. We prepare the manufacturing release package — fabrication and assembly drawings, the BOM with approved manufacturers, programming files and test specifications — and hand it over to the contract manufacturer (EMS) you choose. If you have not chosen one, we help you evaluate candidates through technical capability assessments and a pilot build. See manufacturing support.
No. Rapid Circuitry does not hold ISO 9001, ISO 13485 or other certificates. Our processes are aligned with ISO 9001:2015, and we design products to the requirements of the standards that apply to them — for example IEC 60601-1 and IEC 62304 for medical devices (with design documentation structured so your ISO 13485 quality system can absorb it) and IEC 61000 for EMC — and we specify IPC-A-610 workmanship classes for assembly. We prepare the product and its documentation for certification testing at accredited laboratories; the certificate or approval is issued for your product by the laboratory, notified body or regulator.
A short, non-confidential description of the product and what it must do (sensors, connectivity, on-device processing), the target production volume and unit cost, the markets and regulations it must meet (for example FDA, CE or FCC), your timeline, and what already exists: a concept, a proof of concept, schematics, PCB files or firmware. After the NDA, the next step is a 30-minute discovery call with the engineers who would work on the project, followed by the fixed-scope proposal. Send a project brief to begin.
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